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Items 1 - 10 of 14
This trayless mobile rack for 3.5 inch SATA harddisks has an efficient passive cooling system. The design of the aluminum housing allows the heat to be dissipated from the hard drive without the need for a fan, ensuring quiet operation.
Compact aluminum heatsink with quiet running active fan for compact ITX systems or servers from 2U. The mounting is accomplished via "Push-Pin" fastening with plastic pins - without screwing a base plate underneath the mainboard. Suitable for intel processors with socket LGA1700 ("Alder-Lake S and Raptor Lake" / 12th/13th gen.) and a max. TDP of up to 125 Watt.
Compact aluminum heatsink with robust and durable active fan. Suitable for 19 inch systems and servers from 3U (height units) and up. The mounting is accomplished via screw connection in a supplied metal base plate underneath the mainboard. Suitable for intel processors with socket LGA1700 ("Alder-Lake S and Raptor Lake" / 12th/13th gen.) and a max. TDP of up to 125 watts.
Very powerful and extremely compact cooler for AMD EPYC processors with SP3 socket. The cooler fits into 19-inch cases from 1U or larger and cools processors with a maximum TDP of up to 225 Watts.
Very powerful and extremely compact cooler for intel processors with socket FCLGA 3647 in narrow ILM format. The cooler fits into 19-inch enclosures with 1U or larger and cools processors with a maximum TDP of up to 165 watts - but works quite loudly.
Compact copper/aluminum heatsink with integrated heatpipes and active fan for 19 inch systems and servers from 2U (height units). Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 125 watts.
Compact aluminum heatsink with active fan for 19 inch systems and servers from 2U (height units) or small form factor systems (SFF). Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 65 watts.
Compact copper heatsink with active fan for 19 inch systems and servers with 1U (height units). Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 125 watts.
Compact copper heatsink with active fan for 19 inch systems and servers with 1U (height units). The mounting is done via "push-pin" mounting with plastic pins - without screwing a base plate underneath the mainboard (as is the case with the alternative model Dynatron Q3). Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 125 watts.
Tower heatsink from copper and aluminum with active fan for 19 inch systems and servers from 3U (height units) and up. The mounting is accomplished with screws that connect to the included metal base plate underneath the mainboard. Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 125 watts.
Items 1 - 10 of 14