German
Top items
Items 1 - 10 of 18
With the RM14300, Chenbro offers a high quality 19" enclosure with a depth of only 41cm and 1U, which is suitable for use with mini ITX and micro ATX mainboards. The enclosure can also be installed rotated by 180 degrees so that the rear ports of the mainboard are accessible from the front.
LGA1700
Compact aluminum heatsink with quiet running active fan for compact ITX systems or servers from 2U. The mounting is accomplished via "Push-Pin" fastening with plastic pins - without screwing a base plate underneath the mainboard. Suitable for intel processors with socket LGA1700 ("Alder-Lake S and Raptor Lake" / 12th/13th gen.) and a max. TDP of up to 125 Watt.
LGA1700
Compact aluminum heatsink with robust and durable active fan. Suitable for 19 inch systems and servers from 3U (height units) and up. The mounting is accomplished via screw connection in a supplied metal base plate underneath the mainboard. Suitable for intel processors with socket LGA1700 ("Alder-Lake S and Raptor Lake" / 12th/13th gen.) and a max. TDP of up to 125 watts.
This short 2U rack-mount server case by Chenbro with a length of 45,7cm is ideal for use in short-length racks - like mobile flightcases or in narrow network-cabinets. It is offered here in the version with lockable front-cover. The case supports mini ITX, micro ATX and even full-size ATX mainboards.
LGA1700
Tower heatsink from copper and aluminum with active fan for 19 inch systems and servers from 3U (height units) and up. The mounting is accomplished with screws that connect to the included metal base plate underneath the mainboard. Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 125 watts.
LGA1700
Compact copper heatsink with active fan for 19 inch systems and servers with 1U (height units). The mounting is done via "push-pin" mounting with plastic pins - without screwing a base plate underneath the mainboard (as is the case with the alternative model Dynatron Q3). Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 125 watts.
LGA1700
Compact copper heatsink with active fan for 19 inch systems and servers with 1U (height units). Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 125 watts.
LGA1700
Compact aluminum heatsink with active fan for 19 inch systems and servers from 2U (height units) or small form factor systems (SFF). Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 65 watts.
LGA1700
Compact copper/aluminum heatsink with integrated heatpipes and active fan for 19 inch systems and servers from 2U (height units). Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 125 watts.
Very powerful and extremely compact cooler for intel processors with socket FCLGA 3647 in narrow ILM format. The cooler fits into 19-inch enclosures with 1U or larger and cools processors with a maximum TDP of up to 165 watts - but works quite loudly.
Items 1 - 10 of 18