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Very robust and lockable M.2 NVMe SSD removable frame for the installation of an NVMe SSD in a free PCIe expansion slot (from PCIe x4 up) with full or low height. The adapter supports the installation of NVMe SSDs with 30/42/60/80mm length (M.2 2230, 2242, 2260, 2280). The removable frame is compatible with PCIe 3.0/4.0 NVMe SSDs and is ideal for the uncomplicated expansion of systems with an additional NVMe SSD. A suitable slot bracket for converting the removable frame to a low-profile installation height is included.
With the RM14300, Chenbro offers a high quality 19" enclosure with a depth of only 41cm and 1U, which is suitable for use with mini ITX and micro ATX mainboards. The enclosure can also be installed rotated by 180 degrees so that the rear ports of the mainboard are accessible from the front.
LGA1700
Compact aluminum heatsink with quiet running active fan for compact ITX systems or servers from 2U. The mounting is accomplished via "Push-Pin" fastening with plastic pins - without screwing a base plate underneath the mainboard. Suitable for intel processors with socket LGA1700 ("Alder-Lake S and Raptor Lake" / 12th/13th gen.) and a max. TDP of up to 125 Watt.
LGA1700
Compact aluminum heatsink with robust and durable active fan. Suitable for 19 inch systems and servers from 3U (height units) and up. The mounting is accomplished via screw connection in a supplied metal base plate underneath the mainboard. Suitable for intel processors with socket LGA1700 ("Alder-Lake S and Raptor Lake" / 12th/13th gen.) and a max. TDP of up to 125 watts.
This short 2U rack-mount server case by Chenbro with a length of 45,7cm is ideal for use in short-length racks - like mobile flightcases or in narrow network-cabinets. It is offered here in the version with lockable front-cover. The case supports mini ITX, micro ATX and even full-size ATX mainboards.
LGA1700
Tower heatsink from copper and aluminum with active fan for 19 inch systems and servers from 3U (height units) and up. The mounting is accomplished with screws that connect to the included metal base plate underneath the mainboard. Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 125 watts.
LGA1700
Compact copper heatsink with active fan for 19 inch systems and servers with 1U (height units). The mounting is done via "push-pin" mounting with plastic pins - without screwing a base plate underneath the mainboard (as is the case with the alternative model Dynatron Q3). Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 125 watts.
LGA1700
Compact copper heatsink with active fan for 19 inch systems and servers with 1U (height units). Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 125 watts.
LGA1700
Compact aluminum heatsink with active fan for 19 inch systems and servers from 2U (height units) or small form factor systems (SFF). Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 65 watts.
LGA1700
Compact copper/aluminum heatsink with integrated heatpipes and active fan for 19 inch systems and servers from 2U (height units). Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 125 watts.
Items 1 - 10 of 22