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Items 1 - 10 of 19
This short 2U rack-mount server case by Chenbro with a length of 45,7cm is ideal for use in short-length racks - like mobile flightcases or in narrow network-cabinets. It is offered here in the version with lockable front-cover. The case supports mini ITX, micro ATX and even full-size ATX mainboards.
With the RM14300, Chenbro offers a high quality 19" enclosure with a depth of only 41cm and 1U, which is suitable for use with mini ITX and micro ATX mainboards. The enclosure can also be installed rotated by 180 degrees so that the rear ports of the mainboard are accessible from the front.
This short 2U rack-mount server case by Chenbro with a length of 45,7cm is ideal for use in short-length racks - like mobile flightcases or in narrow network-cabinets. The case supports mini ITX, micro ATX and even full-size ATX mainboards.
Dual Mini Backplane for the installation of two 2.5 inch SAS/SATA hard disks or SSDs in an internal 3.5 inch drive bay. The backplane is ideally suited for setting up a RAID-1 array in a small PC case (e.g. HTPC, Miniserver). The frame is completely made of robust metal and can accommodate HDDs and SSDs up to a maximum height of 9.5mm each.
High quality extended-ATX server tower chassis from Chenbro for professional applications. Basic chassis without power-supply or backplane. The case is suitable for operation with large server-mainboards (up to 12" x 13" / E-ATX), but can also be used with smaller standard mainboards (mini ITX, micro ATX, standard ATX).
LGA1700
Compact aluminum heatsink with quiet running active fan for compact ITX systems or servers from 2U. The mounting is accomplished via "Push-Pin" fastening with plastic pins - without screwing a base plate underneath the mainboard. Suitable for intel processors with socket LGA1700 ("Alder-Lake S and Raptor Lake" / 12th/13th gen.) and a max. TDP of up to 125 Watt.
LGA1700
Compact aluminum heatsink with robust and durable active fan. Suitable for 19 inch systems and servers from 3U (height units) and up. The mounting is accomplished via screw connection in a supplied metal base plate underneath the mainboard. Suitable for intel processors with socket LGA1700 ("Alder-Lake S and Raptor Lake" / 12th/13th gen.) and a max. TDP of up to 125 watts.
Very powerful and extremely compact cooler for AMD EPYC processors with SP3 socket. The cooler fits into 19-inch cases from 1U or larger and cools processors with a maximum TDP of up to 225 Watts.
Very powerful and extremely compact cooler for intel processors with socket FCLGA 3647 in narrow ILM format. The cooler fits into 19-inch enclosures with 1U or larger and cools processors with a maximum TDP of up to 165 watts - but works quite loudly.
LGA1700
Compact copper/aluminum heatsink with integrated heatpipes and active fan for 19 inch systems and servers from 2U (height units). Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 125 watts.
Items 1 - 10 of 19