Dynatron
Items 1 - 10 of 17
Sehr flacher passiver CPU Kühlkörper aus Aluminium für 1HE Server. Geeignet für Sockel 1150, 1151, 1155 und 1156 (z.B. Core i3, i5, i7, XEON 3400 Series etc.).
Very flat copper-heatsink with active radial-fan for 1U server-systems. Compatible with socket 1150, 1151, 1155, 1156 and 1200 (i.e. Core i3, i5, i7, XEON 3400 series etc.)
Very flat aluminum heatsink with silent active radial-fan for 19-inch rack-mount server-systems with a height of 1U or other very compact computer-systems. Supports intel processors with socket 1150, 1155, 1156 and 1200 (i.e. Core i3, i5, i7 etc.) and a TDP of up to 55 watts. High-grade and robust industrial quality from Dynatron.
Very flat copper-heatsink with active radial-fan for 1U server-systems. Compatible with socket 1150, 1151, 1155, 1156 and 1200 (i.e. Core i3, i5, i7, XEON 3400 series etc.).
Powerful and compact CPU-cooler for AMD processors with AM4/AM5 socket. The cooler fits into19-inch rack-mountable housings 2U or larger and cools processors with a maximum TDP of up to 95 watts.
Very powerful and extremely compact cooler for AMD EPYC processors with SP3 socket. The cooler fits into 19-inch cases from 1U or larger and cools processors with a maximum TDP of up to 225 Watts.
Compact aluminum heatsink with active fan for 19-inch rack-mount server-systems with a height of 2U+ or other very compact computer-systems. Supports intel processors with socket 1150, 1155, 1156 and 1200 (i.e. Core i3, i5, i7 etc.) and a TDP of up to 125 watts. High-grade and robust industrial quality from Dynatron.
Compact aluminum heatsink with quiet running active fan for compact ITX systems or servers from 2U. The mounting is accomplished via "Push-Pin" fastening with plastic pins - without screwing a base plate underneath the mainboard. Suitable for intel processors with socket LGA1700 ("Alder-Lake S and Raptor Lake" / 12th/13th gen.) and a max. TDP of up to 125 Watt.
Compact copper heatsink with active fan for 19 inch systems and servers with 1U (height units). Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 125 watts.
Compact copper/aluminum heatsink with integrated heatpipes and active fan for 19 inch systems and servers from 2U (height units). Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 125 watts.
Items 1 - 10 of 17